发明名称 APPARATUS FOR CONVEYING A LEAD FRAME MOUNTING SEMICONDUCTOR PELLETS
摘要 An apparatus for conveying a lead frame mounting semiconductor pellets comprises a guide path for guiding the lead frame, and a feed member. The feed member is moved by a solenoid mechanism from a first position where the feed member is separated from the lead frame to a second position where the feed member engages with the lead frame. The feed member positioned in the second position is moved by a X-Y table from an initial position to a forward position along the guide path, whereby the lead frame is conveyed along the guide path by a predetermined distance.
申请公布号 GB2111453(A) 申请公布日期 1983.07.06
申请号 GB19820028642 申请日期 1982.10.07
申请人 * TOKYO SHIBAURA DENKI KK 发明人 TOMIO * KASHIHARA;TOSHIRO * TSURUTA;MASAYOSHI * YAMAGUCHI;KIYOTACHI * YOKOI;ETSUJI * SUZUKI
分类号 H01L21/50;H01L21/677;(IPC1-7):65G25/02 主分类号 H01L21/50
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