发明名称 FORMATION OF METAL BALL FOR WIRE BONDING AND APPARATUS FOR THE SAME
摘要 PURPOSE:To prevent oxidation of metal ball by forming metal ball through the fusing of the wire tip by applying a voltage across the wire tip and electrode within an inactive ambient. CONSTITUTION:An inactive gas, for example, N2 is supplied to a gas sealed pipe 5 as shown by the arrow mark 7A and then it is outflown through an aperture 6 as indicated by the arrow mark 7B. A bonding tool 2 allowing insertion of an aluminium wire 1 is moved downward and is guided into the aperture 6. when a high voltage is applied to an electrode 8 in such a condition, discharging occurs between the electrode 8 and wire 1. Thereby, the wire tip 1 is melted and a metal ball for wire bonding is formed.
申请公布号 JPS58111331(A) 申请公布日期 1983.07.02
申请号 JP19810209385 申请日期 1981.12.25
申请人 HITACHI SEISAKUSHO KK;HITACHI OUME DENSHI KK 发明人 FUJIOKA SHIYUNICHIROU
分类号 B23K1/00;B23K20/00;H01L21/60 主分类号 B23K1/00
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