摘要 |
A method for mounting one or a plurality of multilead components (25-28) on a circuit board (20) is herein disclosed. The method comprises the steps of loading a releasable template (32) with the component/components to be mounted, positioning the releasable template proximate to the board, releasing the component/components from the template onto the board such that each lead of each component is proximate to a corresponding aperture in the board, and imparting a vibratory motion (via 29 and 23) to the board thereby inserting the component/components into the board. Also disclosed are various embodiments of an apparatus for achieving this mounting method using a programmable robotic arm (FIG. 2). |