| 摘要 |
A curable epoxy resin composition of substantially improved curing time and high temperature properties comprising a polyepoxide of the formula: <IMAGE> wherein R is H or an alkyl of up to about 18 carbon atoms, X is H or halogen, Y is an alkyl of up to about 18 carbon atoms or methoxy, Z' is H or CH3, m is an integer of not less than 1, n is an integer of up to 2, and from about 25 to about 120 parts by weight, per 100 parts by weight of the polyepoxide, of an epoxy resin hardener.
|
