| 摘要 |
<p>A process for applying a patterned coating to a circuit board (31) without the use of a patterning mask. A surface (30) of the circuit board is coated with uncured material (32) having a cure reaction which is inhibited by the presence of oxygen. The thickness of the material on land areas (34) surrounding holes (36) through the circuit board is reduced by causing a portion of the material to flow into the holes. The material is then exposed, in the presence of oxygen, to an energy source which advances the cure reaction only of sublayers (37) of the material which are isolated from the oxygen by overlayers (38) of the material. Surface layers of the material, including substantially the entire thickness of the reduced thickness portions of the layer, remain uncured, allowing subsequent selective removal of the uncured portions of the material.</p> |
