| 摘要 |
PURPOSE:To remove cracks and to alleviate strain, by using a noncrystalline, reversible material which has a working temperature lower than that of solder glass which fixes a seat to a package board, as a solder glass which bonds a pressure sensitive pellet to the seat. CONSTITUTION:The first solder glass 15 bonds and fixes the pellet 11 to the seat 14. The second solder glass bonds and fixes a base glass 22, which is filled in the package board 21 to the seat. The material, which is not crystallized and has the reversible property with respect to the working temperature which is repeatedly applied in comparison with the second solder, is used for the first solder glass 15. Even though stress or strain occurs in the solder glass 15, the same working temperature is applied to the solder glass 15 when the seat 14 and the base glass 22 are bonded by the second solder glass 23, the solder glass 15 is melted again, cracks are repaired, and the stress and strain are alleviated. |
