发明名称 Substrate for hybrid and printed circuits
摘要 A hybrid or printed circuit is formed on a substrate (1) which comprises an iron-chromium- aluminium alloy which may also contain Yttrium and which forms a stable inert strongly adhering ceramic layer (5, 6) on its exposed surfaces when heated in an oxidising atmosphere. To produce a hybrid circuit a dielectric paste is printed on the ceramic surface (5) of the alloy to form a platform (9). Conductors (10, 11) are then printed on the dielectric platform (9) and fired. One or more component(s) (8) is/are then soldered to the conductors. <IMAGE>
申请公布号 GB2110475(A) 申请公布日期 1983.06.15
申请号 GB19810033262 申请日期 1981.11.04
申请人 * PHILIPS ELECTRONIC AND ASSOCIATED INDUSTRIES LIMITED 发明人 CHRISTOPHER JOHN * RANSOM
分类号 H01L23/14;H01L25/16;H05K1/03;H05K1/05;H05K1/09;H05K3/12;(IPC1-7):05K1/05 主分类号 H01L23/14
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