| 摘要 |
<p>A semi-conductor device 11 is mounted on an electrically conductive element 12 of e.g. copper, which element is itself mounted upon, but electrically insulated from, an electrically conductive heat sink 13, by a method including a stage in which the conductive element 12, which is of sufficient thickness to be self-supporting, and the heat sink 13 are spaced from one another by a layer of molten electrically insulating siliceous material 14 e.g. glass, porcelain, ceramic or enamel which, upon subsequent solidification, secures element 12 to heat sink 13 while electrically insulating it therefrom. A conductive element 22 may be formed from aluminium strip which is significantly thicker than element 12, and may be provided with a copper pad 23. Additionally, by leaving windows in layer 14 the heat sink 13 may function as a conductive element with semiconductor devices directly soldered thereto. The method may be used in fabricating a rectifier assembly. <IMAGE></p> |
