| 摘要 |
PURPOSE:To stabilize the three-dimensional element machanically and electrically by also forming protective films to the side surfaces of the element. CONSTITUTION:Numerals 100 in the figure is the three-dimensional element in which semiconductor layers to which circuit elements are shaped are laminated in three dimensions. Numerals 200 are the protective films formed to the side surfaces of the three-dimensional element 100. The protective film 200 can be shaped by depositing a silicon oxide film or a silicon nitride film normally used among each layer through a method, such as CVD, sputtering, etc. An organic matter group material such as polyimide can also be coated onto the side surfaces. The mechanical and electrical stability of the three-dimensional element can be improved by shaping such protective films. |
