| 摘要 |
PURPOSE:To safely and simply detect the presence of pellet cracks without damaging an undamaged semiconductor device, by putting heat sink plates of a semiconductor device on a saturated hydrocarbon resin and heating them to test paging. CONSTITUTION:At the test of the presence of pellet cracks in a semiconductor device 3 having heat sink plates on its back side, the semiconductor device 3 is put on a saturated hydrocarbon resin (solid at room temperature and liquid at high temperatures) 1 accumulated on a tray 2 having a glass rod 6 to attach/ detach the tray 2 so that the heat sink plate is faced to the resin side 1, and the tray 2 is inserted into a furnace center pipe 5 of a heating furnace 4. Figure II is obtained by observing figureIfrom the arrow direction. Subsequently, the tray 2 is removed from the furnace 4 and cooled and the solid resin is removed. Thus the resin is reusable and generates no harmful object unlike conventional soldering, so that paging can be simply tested without damaging the undamaged device 3. |
