| 摘要 |
PURPOSE:To simplify the working process as well as to facilitate the automated production of the titled semiconductor device by a method wherein the external and internal electrodes of same polarity are joined together and connected using a heated up and fused solder piece. CONSTITUTION:A solder piece 21 is placed on each metalized layer 3 provided on the T1 external electrode 6 and the G external electrode 7 located on an insulative substrate 1. On one piece 21, the electrode 6 and a T1 inner electrode 22 are placed by arranging them at a small space between them. On the other piece 21, the electrode 7 and a G internal electrode 23 are placed by arranging them at a small space between them. Solder piece are inserted between each part other than the place where the pieces 21 are placed, and the above are joined together simultaneously by performing the soldering work in a hydrogen atmosphere. Thus, the electrodes 6 and 22, and electrodes 7 and 23 are connected through the intermediary of the solder piece located between them. Through the above-mentioned procedures, the external electrode and the internal electrode, which are placed on the solder piece, are connected by performing a soldering work, thereby enabling to simplify the working process and to facilitate the automation of the semiconductor device. |
