| 摘要 |
PURPOSE:To miniaturize a preparatory chamber, and to covey a wafer positively by using a wind-out and take-up type shuttle fork and making the thickness of a fork section at the catching side thicker than that of a fork section at the reception side in a shuttle fork for carry-in. CONSTITUTION:A forked shuttle fork 17a for carry-out is mounted into the preparatory chamber corresponding to a stage 14a at the carry-out side, and is expanded and contracted through wind-out and winding, and the inner surface of its lower end has wafer placing sections 18a. The shuttle fork 17b for carry-in is set up into the preparatory chamber corresponding to a stage 14b at the carry-in side, and is expanded and contracted through wind-out and taking-up, and the inner surface of its lower end has wafer placing sections 18b. The thickness of the fork section 171 at the wafer receiving side is made thinner than that of the fork section 172 at the another catching side in the shuttle fork 17b for carry-in. |
