| 摘要 |
PURPOSE:To pour solder easily by forming the section of the appliance holding a lead wire and an IC pin in funnel-shaped form in order to solder the lead wire and the IC pin. CONSTITUTION:The pin 3 side of the IC is upward positioned, the pins 3 and the lead wire 2 are held by means of the appliance 5, and solder 4 is placed. The appliance 5 is shaped in funnel-shaped form at every one pin, and formed so as to easily pour solder. When solder is melted, the lead wire 2 and the pins 3 can be joined. The IC to which the lead wire 3 is joined is inserted into a socket, and the socket is fixed to a substrate. Accordingly, the mutual short circuits of the IC pins and the degradation of the IC can be prevented. |
