| 摘要 |
PURPOSE:To sputter a ferromagnetic material through a magnetron type sputtering device, by providing grooves in the surface of a ferromagnetic material target, and giving N or S polarity to its opposite end part. CONSTITUTION:In the surface of a target 1 made of a ferromagnetic material such as Fe, Ni, and Co, grooves 3 are formed and on its reverse surface, an E- shaped magnet 3 is provided. The device is evacuated to a low vacuum, Ar gas is admitted, and the magnet 2 established a magnetic field to the target 1. The thickness of the target 1 is reduced partially at the grooves 3, so magnetic saturation is easily obtained by using a relatively weak magnet 2 to form lines of magnetic force 15 between the N and S poles. At this time, a voltage from a power source 12 is applied between the target 1 as a cathode and an anode 11 to cause glow discharged, and then the target material is hit out of the grooves 3 by the impact of cations to form a plating film 16 of the ferromagnetic material on the surface of a substrate 13, thus performing low-temperature speedy magnetron sputtering. |
