| 摘要 |
PURPOSE:To improve reliability even when the whole package is miniaturized by ameliorating the accuracy of the partial plating of gold plating or silver plating or the like executed to an inner lead section in which a wire is bonded to a lead pin. CONSTITUTION:Insulators 21 are set up to the surface of the lead pins 14 connected to a semiconductor element 13 by the bonding wires 15. That is, the insulators 21 are fixed through adhesives so as to partition the inner lead sections 16 of the lead pins 14 and an outer lead sections 17 connected to external wiring. The inner lead sections 16 of the lead pins 14 are plated with silver. The insulators 21 function as protective walls in the outer lead sections 17 of the lead pins 14, and the formation of unnecessary plating such as the protrusion of silver plating can be prevented positively. |
