| 摘要 |
PURPOSE:To improve wiring efficiency on a printed circuit board by assembling wiring patterns into an LSI package. CONSTITUTION:The input/output pins 2 are connected to an LSI in a package 1 and are extruded to the one surface in parallel two lines with a constant interval and a pitch, for example, of a/2. The wiring pattern pins 3 are also extruded in parallel at the outside of said pins 2 and the pitch is determined as (a) corresponding to the substrate wiring lattice. The wiring pattern 4 is provided within the package 1 and the corresponding pins 3 are connected in one to one basis. According to this package, the wiring between the points b and c does not require an alternative route, does not occupy extra wiring lattice points and can be realized in the shortest length as directly wired at the wiring basic lattice 8 because the printed wiring 12 is used for connections between the points bb1 and connection between the points c1c, while the assembled wiring 4 is used for connection between points b1c1. Connection between wirings 12 and 4 is realized by the pins 3 through the fitting hole 7. |
