| 摘要 |
PURPOSE:To make the titled device fit to mass production while solving the problem, etc. of leakage in the incorporating section of a light transmitting section and the sealing section of a lead by forming a hollow section to a package through resin seal and shaping the package while giving light transmitting property to one part. CONSTITUTION:The tabular section 1a of the first sealing resin body and a frame section 1b are bonded by adhesives such as epoxy resin while holding a lead frame 2, sections among the leads 2a, 2b... of the lead frame are filled and airtight sealing is attained, and a concave section 3 afterward functioning as space is formed to a central section. The lead frame may previously be transfer- molded and shaped integrally in the structure. One main surface of the semiconductor chip head 2m of the lead frame is exposed to the recessed bottom of the center in any case, a semiconductor chip 4 is fixed to the head, and the electrode of the chip is electrically connected to the leads 2a, 2b... made correspond and drawn out by means of bonding wires 5a, 5b.... A light transmitting cover 8 is contacted with the mount body 6 through the seal 7 of a silicon rubber, and the titled device is formed through mold sealing by epoxy shielding resin 9. |
