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发明名称
COPPER COLLOID AND METHOD OF ACTIVATING INSULATING SURFACES FOR SUBSEQUENT ELECTROPLATING
摘要
<p>Colloidal copper solutions containing palladium useful for activating non-conductive substrates for subsequent electroless and electrolytic plating.</p>
申请公布号
WO1983001794(A1)
申请公布日期
1983.05.26
申请号
US1981001544
申请日期
1981.11.20
申请人
发明人
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主分类号
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