| 摘要 |
1. Device for the desoldering of electronic components from printed circuit boards, having a device for melting the soldered joints, having a draw-off device comprising a resilient gripper, which is at least partially enclosed by a housing and which is fitted at a pull rod which stands under spring action, and having a device for removing solder residues from the bores of the printed circuit board, characterized in that the device for removing solder residues is formed from the housing (46) of the resilient gripper (36) and a compressed air duct (50), which is attached thereto and which is connected to a compressed air source, and in that the housing (46) entirely receives the resilient gripper (36) and the electronic component (80) and rests by its lower, circulating rim (47) on the printed circuit board (80). |
