发明名称 Gold based compounds for electrical contact materials
摘要 Gold-based intermetallic compounds suitable as a contact material for electrical contacts are presented. The gold-based electrical compounds are selected from a group consisting of Au4In, Au10Sn, and AuPd or from intermetallic compounds having an ordered hexagonal crystal structure and of the type AunX where n is at least 3 and X is selected from a group consisting of In, Sn, and Pd.
申请公布号 US4385029(A) 申请公布日期 1983.05.24
申请号 US19810258157 申请日期 1981.04.27
申请人 THE UNITED STATES OF AMERICA AS REPRESENTED BY THE SECRETARY OF THE NAVY 发明人 DESAI, JAYDEV D.
分类号 C22C5/02;H01H1/023;(IPC1-7):C22C5/02 主分类号 C22C5/02
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