摘要 |
Gold-based intermetallic compounds suitable as a contact material for electrical contacts are presented. The gold-based electrical compounds are selected from a group consisting of Au4In, Au10Sn, and AuPd or from intermetallic compounds having an ordered hexagonal crystal structure and of the type AunX where n is at least 3 and X is selected from a group consisting of In, Sn, and Pd.
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