Plating process

摘要

In a simple process for plating silicon with nickel which does not require any catalytic pretreatment of the silicon surface which is to receive the nickel, a silicon substrate is immersed in a suitable nickel bath which is such that nickel ions are reduced to solid nickel in the bath and are deposited on the substrate to form a layer which adheres to it. The process is suitable in a particularly advantageous manner for nickel-plating silicon devices which have p-n junctions near the surface, for the purpose of forming ohmic contacts.