| 摘要 |
PURPOSE:To precisely detect the chip cavity position by a method wherein a window forming a chip cavity into which a chip is inserted is first punched and simultaneously chip cavity identification marks being stamped using the same die are provided. CONSTITUTION:A first ceramic plate 12 has a chip stage surface 11 at least on top thereof. A second ceramic plate 16 has a window 14 into which a chip is inserted for exposing the surface 11 and wiring is provided at least on its surface. A third ceramic plate 19 has a window 17 for exposing the window 14 and a region on its periphery for connecting wires. A ceramic package for a semiconductor device is formed of the plates 12, 16, 19 successively piled on top of each other. The window 14 for forming a chip cavity in the surface of the region for connecting wires in the plate 16 is punched and simultaneously chip cavity identifying marks 15a, 15b stamped by the same die are provided. Consequently, since the relative positions of the chip cavity and the marks 15a, 15b are not shifted, the chip cavity position can be detected accurately by the use of, for instance, a TV camera. |
