| 摘要 |
PURPOSE:To greatly shorten the testing time for a resin sealed semiconductor device, by providing joints for reinforcement connecting leads and a frame. CONSTITUTION:Joints for reinforcement 9 or 10 are provided connecting emitter leads 1b and a frame 2 and elements are sealed by resin materials 4a-4e. Thereafter, even when a frame 5 is removed, and collector leads 1a and base leads 1c are separated from the frame 2, the position of the resin material 4, i.e. each semiconductor device is stabilized by the joints for reinforcement 9 or 10. After the characteristic test by contacting probes 6 on leads 1a, 1c, the reinforcement joints 9 or 10 are removed. In this method, a testing time can be shortened greater than the case using a parts feeder. |
