| 摘要 |
<p>This invention relates to a resilient filamentary cushioning unit or pad and a process for its production wherein a plurality of substantially amorphous thermoplastic filaments, e.g., fiber-forming polyamide filaments, are melt-spun into a liquid cooling bath in such a manner that they lie in the form of predominately helical to sinuous loops randomly bonded at their points of intersection as the filaments are completely solidified in the bath. The resulting looped and bonded filaments form a cohesive resilient structure which is useful as a spring core or cushioning unit.</p> |
