发明名称 MANUFACTURE OF CHIP HOLDER FOR JOSEPHSON IC
摘要 PURPOSE:To form a plurality of contact electrodes with micro dimensions in high densities with good positioning accuracy, by forming a plurality of strip lines constituted of conductive layers by a photoetching technique on an insulator substrate wherein a conductive layer is formed on the surface, and bending the end part of electrodes to the direction away from the insulator substrate. CONSTITUTION:Strip lines 2 are formed on the insulator substrate 1 wherein the conductive layer is formed by a photoetching technique so that one end thereof may come to the position outside of respectively corresponded J-JIC contact pads. On the lines, a low melting point metallic layer 3 such as solder is made to adapt to the surface by fusing the solder with the increase of the temperature of the plating or the insulator substrate 1, a conductor thin plate 4 of phosphor bronze, e.g. having a spring function is closely contacted thereon, and then the temperature is increased resulting in soldering. Contact electrodes 5 are formed by a positioning photoetching of this conductor thin plate 4 by using said positioning exposure mark, and the end part not fixed is slightly bent upward.
申请公布号 JPS5867080(A) 申请公布日期 1983.04.21
申请号 JP19810165341 申请日期 1981.10.16
申请人 NIPPON DENKI KK 发明人 YOSHIDA TAKUKATSU;SONE JIYUNICHI
分类号 H01L39/22;H01L39/04 主分类号 H01L39/22
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