| 摘要 |
PURPOSE:To improve the adherence of resin and to simultaneously prevent the deterioration of electrodes of a semiconductor element due to invasion of moisture and the removal of externaly led lead wires by roughening the surface and back of a part of a lead frame. CONSTITUTION:A lead frame 200 is formed of copper, iron or their alloys, has a die pad 201 and externally led lead wires 202, and is plated with noble metal 204 such as gold or silver. The front and back surfaces, and in some cases the surface over the entire periphery of the region 209 sealed with resin 208 of the frame 200 are formed to be rough. A semiconductor element 105 is fixed to a die pad 201 which conductive adhesive 206 such as paste or the like, electrodes and the wires 202 are connected at the ends 203 of the lead wires via fine metal wires 207, and the element 205, wires 207 and the mounting part of the lead frame are sealed integrally with the resin 208. |
