LEAD CONNECTION TO HYBRID INTEGRATED CIRCUIT DEVICES AND METHOD OF APPLYING THE SAME

摘要

Circuit elements and lead connecting metal pieces are set on a conductor circuit formed on a ceramic substrate and are bonded to the conductor circuit by reflow soldering. A head of a lead is set on each of the metal pieces and connected thereto by setting electrodes in contact with the lead head and supplying welding current from the electrodes through the lead head and metal piece.