摘要 |
PURPOSE:To contrive the reduction of a load applied to a wire and to prevent the breakage of the wire by forming the cross section of a wire path in a nonround shape. CONSTITUTION:A wire path 2A passing through a wire 3 is provided at the lower part of a tool 1 for bonding using ultrasonic wave vibration. The shape of the cross section of the path 2A is an oval shape and the major diameter direction coincide with the tension direction of the wire 3. Therefore, after the first bonding, when the wire 3 is taken out as the tool 1 moves to the second bonding position, the wire 3 will not be squeezed as the diameter of the wire path 2A in the tension direction is large and a load applied to the wire 3 is reduced. |