| 摘要 |
PURPOSE:To make the titled device inexpensive, by heating and molding a glass plate, and manufacturing a package. CONSTITUTION:A plurality of rectangular prism shaped projections 5a are formed at a lower surface of a top mold 5. A plurality of rectangular prism shaped recesses 7a are formed at the upper surface of a bottom mold 7. The top mold 5 and the bottom mold 7 are preheated at a softening temperature of a glass plate 6 and they are overlapped by clipping the glass plate 6, and a pressure is gradually exerted to form a plurality of recesses 6c on the glass plate. Specified electrodes 8 and insulating film 9 are patterned on the glass plate 6 and a two-layer coating film 10 made of a noble metal is formed on the film 9, and solder 11 is coated on the film 9. The glass plate is cut off into pieces to form a package of a crystal oscillator. That is, the recess 6c is used for the play of the resonance section of a crystal chip 13. |
