Phenolic resin compositions

摘要

Phenolic resin compositions comprising a polymeric substance having a phenolic OH group such as phenol resins, and a rubber having an epoxy group and an epoxy equivalent of 500 to 30,000 such as butadiene copolymers, acrylic copolymers, chloroprene copolymers and urethane copolymers are provided. These resin compositions exhibit improved properties having overcome the drawback of brittle properties intrinsic of conventional phenolic resins, and also exhibit cold resistance; hence they are used as molding materials, laminating materials, casting materials, binders, etc. Further, molding resin compositions having improved solvent-resistance and metal insert properties are provided.