| 摘要 |
PURPOSE:To promote the function of protecting semiconductor chip from detrimental materials by a method wherein the resin case enclosing semiconductor chip is covered with at least two caps and the gap between said caps is fused by melted glass and said melted glass is the one being coated on the cap. CONSTITUTION:The semiconductor chips 1 are connected to the lead 3 by means of wire bonding process and the resin case 2 covering at least two semiconductor chips is fixed by means of transfer mold forming process while a pair of caps 4 is prepared holding these two main surfaces. The caps 4 are inserted into said case 2 and the glass 5 coated by heating is melted to fill the gap between the pair of caps and the caps 4 and the lead 3. The caps 4 do not directly come into contact with the lead 3. The side wherein the lead 3 is not provided is also fused by said melted glass 5. |
