| 摘要 |
PURPOSE:To improve the pattern accuracy of polyimide resin insulation films by coating a photosensitive polyimide precursor material on a substrate. CONSTITUTION:An inorg. insulation film is sputtered on a ceramic substrate 1 to form an underlying film 5 and ''Permalloy '' is deposited thereon by sputtering and is patterned by photoetching techniques, whereby a lower magnetic body 6 is obtained. An inorg. insulation film 7 is sputtered as a gap spacer and is patterned by photoetching. Carboxylic groups of polyamide acids and amino groups of amine compds. are caused to react by ionic bonds and a photosensitive polyimide precursor compounded with a bisazide compd. is coated thereon. After exposure, the same is developed with a solvent and is then heat treated to form patterns 2' of the lower polyimide film. A conductor coil 8 is formed by depositing Cr of 1,000Angstrom by vacuum deposition and patterning the same by photoetching techniques. After the patterns 2'' of the polyimide film in the upper part are formed, an upper magnetic body 9 is formed. |
