发明名称 Etching polyimide resin layers and method of manufacturing a semiconductor device having a layer of polyimide resin.
摘要 <p>The susceptibility to etching of a polyimide resin layer is controlled by implanting ions into the layer. A high close of implanted ions, for example 1 x 10&lt;1&gt;&lt;4&gt; cm&lt;-&gt;&lt;2&gt; substantially prevents etching.</p>
申请公布号 EP0074845(A2) 申请公布日期 1983.03.23
申请号 EP19820304831 申请日期 1982.09.14
申请人 FUJITSU LIMITED 发明人 UCHIYAMA, NOBUHIRO C/O FUJITSU LIMITED;SHINGU, MASATAKA C/O FUJITSU LIMITED;TSUKADA, SABURO C/O FUJITSU LIMITED
分类号 H01L21/768;C09K13/00;H01L21/311;H01L21/312;H01L23/522;(IPC1-7):01L21/32;09K13/02 主分类号 H01L21/768
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