| 发明名称 |
CONDITIONING OF POLYAMIDES FOR ELECTROLESS PLATING |
| 摘要 |
<p>of the Invention Polyamide substrates are pre-conditioned for electroless plating by contact with an alkaline aqueous solution having a pH of at least about 10 and etched with an acid solution. The acid solution is preferably an aqueous solution of an organic acid containing at least two carbon atoms, particularly an acetic acid compound, such as trichloracetic acid.</p> |
| 申请公布号 |
CA1143260(A) |
申请公布日期 |
1983.03.22 |
| 申请号 |
CA19790342112 |
申请日期 |
1979.12.12 |
| 申请人 |
CROWN CITY PLATING CO. |
发明人 |
DILLARD, DAVID A.;MAGUIRE, EILEEN;DONOVAN, LAWRENCE P. |
| 分类号 |
C08G69/46;C08J7/02;C08J7/04;C08J7/12;C23C18/22;C23C18/24;C23C18/26;H05K1/03;H05K3/18;H05K3/38;(IPC1-7):C23F17/00;C23C3/00 |
主分类号 |
C08G69/46 |
| 代理机构 |
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