| 摘要 |
A wire bonding apparatus which can variously change the shape of a loop of a bonding wire and can restrict the loop shape in accordance with specifications of an article being wire bonded. In the wire bonding apparatus, a wire guide unit moving both vertically and transversely, independently of a bonding tool, is disposed in proximity of the bonding tool which moves relative to the article to be wire bonded and which connects the wire between a first bonding region and the second bonding region. A mechanism is provided which changes the shape of the loop of the bonding wire when the wire guide unit moves vertically and transversely. |
