ELECTRODEPOSITING A METAL ON A CONDUCTIVE SURFACE

摘要

An electrodepositing method and apparatus utilizing a substantially hermetically sealed receptacle for accommodating a workpiece therein. An electrodepositing solution is flooded into the region of a gap between an anode and a cathodic conductive surface on the workpiece to allow the electrodepositing current of a high current density from a power supply to be delivered in the gap to electrodeposit a metal from the solution at least predominantly on a limited area on the workpiece surface juxtaposed with an active electrode face of the anode while permitting gases to be electrolytically produced in the gap and to be collected together with mists of the solution in a sealed room or space in the receptacle. The anode and the workpiece are relatively displaced to allow the active electrode face to sweep in a scanning manner over the workpiece surface to maximize the efficiency and performance of electrodeposition. A suction pump is provided to withdraw, under suction, the gaseous effluent accumulated in the space from the receptacle into an outlet duct.