| 摘要 |
<p>PURPOSE:To dispose a semiconductor substrate readily and effectively at the prescribed position in a sealed container by employing as a resin circular-arc shape unit a central position specifying ring and as a guide the inner wall of the container. CONSTITUTION:A ring 13 is formed of thermoplastic resin having large strength readily formed such as Teflon, and is formed with a notch S. The ring 13 is contacted with the inner wall of a ceramic seal 6, thereby preventing the movement of the semiconductor substrate 1. Since there is the notch S, the expansion of the ring 13 is produced circumferentially, the gap of the notch S is shortened, but an anode electrode 2 is not raised, the electrode 2 and the semiconductor substrate 1 are specified always at the prescribed position, and the electrical and thermal couplings with both posts 4, 5 are not disturbed.</p> |
