| 摘要 |
1,234,825. Semi-conductor devices. SIEMENS A.G. 24 Sept., 1968 [2 Aug., 1968], No. 45404/68. Heading H1K. To ensure an effective seal between the metallic terminal bodies and the plastics coating or jacket which with them completes the housing surrounding a junction-containing semiconductor element, at least one of the metallic bodies (at least) where in contact with the plastics consists of sintered material. Fig. 1 shows a slotted housing part and terminal body 1 of sintered iron-copper, iron, copper, nickel, molybdenum, or tungsten with a knurled outer surface. Within the slot is mounted a junctioncontaining silicon wafer 21 soft-soldered between copper discs 22, 23 and edge-protected by lacquer 8. The discs are soft-soldered respectively to the housing part 1 and to the other terminal body 3 (an eyed strip). The assembly is maintained under pressure by a spring 5 (pressing on a ceramic block 4). The housing is completed by the epoxy resin 6 which fills the slot. Other embodiments have: a cup-shaped terminal containing the element and filled with resin; a bus-bar bearing several elements, each plastics-coated; and a housing formed by large terminal discs linked by an annular plastics wall, the element and its contacts being soft-soldered between the discs or held there by external pressure applied by the mounting. |
