| 摘要 |
PURPOSE:To easily realize cooling by forming a through-hole in the tube longitudinal direction to the heat equalizing tube located between the heater and process tube and by flowing the cooling liquid into this through-hole. CONSTITUTION:When the power source is supplied to the heater, it generates heat, giving the heat to the heat equalizing tube 12 and process tube 26. Simultaneously, the process gas is caused to flow into the tube in order to execute the predetermined thermal processing. Thereafter, the power source of heater 11 is suspended and simultaneously a blower 22 is started to operate in order to send the air of atmospheric temperature to the through-hole 13 of the heat equalizing tube 12 via the route 20, air storage 16 and the aperture 18. The heat equalizing tube 12 performs heat exchange between the air flowing into the through-hole 13 and is thereby cooled, also rapidly cooling the tube. When the wafers are taken out under this condition, the wafer is not influenced by the heat. |
