| 摘要 |
An electrical isolation assembly for mounting one or more discrete semiconductor devices 13, 14 in thermal contact with, but electrically isolated from, means 15 for cooling the device(s), comprises a metal conductor plate 2 arranged to make electrical and thermal contact with the semiconductor device(s), the conductor plate 2 being bonded by a fused glass and ceramic compound to a baseplate 3 arranged to make thermal contact with the cooling means 15. The conductor plate 2 may be provided with a terminal 6 for making an electrical connection between the semiconductor devices and an external circuit. <IMAGE> |
