发明名称 TYKFILM-LEDER-PRAEPARAT
摘要 <p>Metallization suitable for making printed thick film terminations comprising an admixture of finely divided particles of palladium/silver as the conductive phase and bismuth-free low-melting, low viscosity devitrifiable glass as the binder phase. The composition optionally contains a spinel-forming metal oxide to raise substrate adhesion.</p>
申请公布号 DK345782(A) 申请公布日期 1983.02.04
申请号 DK19820003457 申请日期 1982.08.02
申请人 PONT DE NEMOURS AND CO 发明人 NAIR K M
分类号 C22C32/00;H01B1/16;H01G4/008;H05K1/09;(IPC1-7):H01B/ 主分类号 C22C32/00
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