发明名称 THICK FILM PRINTED CIRCUIT
摘要 <p>PURPOSE:To prevent the exudation of resistor paste from the air gap which the wiring pattern, stencil screen and substrate form, by a method wherein the thickness of pattern conductors of printed circuits on the insulated substrate is minimized. CONSTITUTION:A stencil screen is laid on a ceramic substrate (5) and such paste (2) as Au and the like, is pressed and moved to print a wiring pattern and burned thereupon. Then, a stencil screen (1) is laid thereon and a resistor paste (6) is pressed and moved by a gum squeegee (5) to print. As the wiring pattern (2) is of some 1m of thickness, the triangular air gap (4) is extremely small, the paste (6) flowing into said air gap (4) is very little and in case of flowing out from said air gap by ways of viscosity it hardly exudes. Therefore, the hole of screen can be reflected conscientiously to print the resistor (7) in a well-ordered way. On burning up continually a thick film printed circuit can be completed. According to this constitution, in a high density pattern the wiring pattern does not come in contact with adjacent resistors to provide a high quality thermal head.</p>
申请公布号 JPS5818953(A) 申请公布日期 1983.02.03
申请号 JP19810117309 申请日期 1981.07.27
申请人 ALPS DENKI KK 发明人 TSUKAHARA MICHIYOSHI
分类号 H01C17/06;H01L27/01;H05K1/16 主分类号 H01C17/06
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