| 摘要 |
PURPOSE:To prevent the deterioration in characteristics and to improve the reliability, by enclosing the entire glass medium including a piezoelectric element with a substance of low melting point and melting off the substance of low melting point through the packaging on the substance with a resin. CONSTITUTION:A glass medium 10 with piezoelectric elements 9 and 9' is provided with lead terminals 8 apart with each other for electrical connection. The glass medium 10 is enclosed with a substance of low melting point 12 such as paraffin, on which is coated with an epoxy resin. Since the substance 12 is absorbed to the resin or evaporated through air-holes of the resin when the epoxy resin is thermally cured, air 14 is produced between the medium 10 and an external package 13. This space 14 avoids the contact part between the glass medium 10 and the package 13, allowing to make the airtight sealing. |
