| 摘要 |
PURPOSE:To mount a title device highly reliably a circuit having a thin-type structure by fixing IC in the concave of a circuit resin substrate, protecting the circumference of the concave and the part other than IC electrodes simultaneously with a resist by printing technique to form an electroconductive pattern, and later covering the pattern with sealing resin. CONSTITUTION:A rather large amount of a bonding agent 12 is dripped in the concave part 9 of a circuit resin substrate 10, an IC 2 having projected electrodes 11 of solder is inserted in the part in such a manner that it is leveled with the upper surface of the substrate 10, and then it is heated and fixed in a correct position. When the IC is pressed in, an excess of the bonding agent 12 is taken in recesses 9a provided at the corners of the concave part 9, thereby the thickness of the bonding agent is made uniform, and thus neither the difference in height nor the protrusion of the bonding agent occurs. The side surfaces at four corners of the IC are also fitted firmly and thereby the fixedness thereof is further increased. After an ultraviolet- setting resist 13 is printed easily on a region other than the electrodes 11, an electroconductive pattern 14 is formed thereon by printing, thereby the lead terminals 8 of the substrate 10 are connected to the electrodes 11, epoxy resin 15 is further printed and heated to be set, and thus a desired circuit is completed. According to the present constitution, the circuit can be packaged much thinly than that prepared by a wire junction method, while a line system production thereof is enabled, and high reliability is obtained. |
