发明名称 MOUNTING ASSEMBLIES FOR ELECTRICAL COMPONENTS
摘要 A mounting assembly for components such as thyristors and diodes consists of heat sinks 1, 2 in which the components are mounted on a top surface. The heat sinks are secured to each other and to side frames 3, 4 by means of insulating blocks 5 which are attached to the top surface of the heat sink by means of bolts running in T shape channels. The insulating blocks 5 also carry electrical connectors by means of which interconnections associated with the operation of the circuit can be made. <IMAGE>
申请公布号 GB2047473(B) 申请公布日期 1983.01.26
申请号 GB19790013561 申请日期 1979.04.19
申请人 AEI SEMICONDUCTORS LTD 发明人
分类号 H01L23/40;H01L25/11;(IPC1-7):05K7/20 主分类号 H01L23/40
代理机构 代理人
主权项
地址