| 摘要 |
<p>PURPOSE:To minimize thermal strain applied to a translucent glass plate, and to obtain a highly reliable solid image pickup device, by previously depositing a soldering material on at least either one of a metallic frame body of a package side or that on a cap side. CONSTITUTION:On a metallic frame body 11 on the side of a package 1, an Au/ Sn soldering material 12 is deposited previously. Consequently, metallic frame bodies 9 and 11 are seam-welded together with a small welding current, and the heating value during the welding is reduced to reduce residual thermal strain to a transparent glass plate 7. Further, the soldering material 12 is stuck previously on the metallic frame body 11 on the package 1 to eliminate a splash of the soldering material 12 completely during the welding to the metallic frame 9 on the side of a cap 10. Further, the sticking of black stains, etc., on the internal surface of the glass plate 7 or on the surface of a photodetecting element 5 is prevented securely and completely to perform stable welding operation.</p> |
