发明名称 HEAT INSULATING DIE PLATE FOR MOLD AND MANUFACTURE THEREOF
摘要 PURPOSE:To enable saving of energy and shortening of a time required for a molding cycle, by using a single poor thermal conductive heat insulative sheet or a plural number of the sheets overlapped with each other that is sandwitched between mold steel materials. CONSTITUTION:Die plates 5, 8 and 13 in a molding machine, such as injection molding machine, compression molding machine, transfer molding machine, or the like consist of base plates 5a, 8a and 13a, heat insulative sheets 5b, 8b and 13b and upper plates 5c, 8c and 13c respectively. It is preferable that the heat insulative plate material consists of mica or glass fiber, whose thermal conductivity is 1/4-1/5 or less of that of a mold steel material, or a complex of the mica and resin, especially thermosetting resin.
申请公布号 JPS5812716(A) 申请公布日期 1983.01.24
申请号 JP19810111778 申请日期 1981.07.16
申请人 MATSUSHITA DENKI SANGYO KK 发明人 MATSUDA SHIYUNSUKE;ITOU AKITAKE;MITANI KATSUAKI
分类号 B29C45/00;B29B13/00;B29C33/00;B29C33/02;B29C33/40;B29C41/00;B29C43/00;B29C45/02;B29C45/26;B29C45/73;B29C45/77 主分类号 B29C45/00
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