| 摘要 |
<p>PURPOSE:To cut off the reference piece for alignment from the Si substrate back side, by providing the laser light source at the upper side of the alignment reference chip such as spot light source. CONSTITUTION:The spot light source 7 on the Si substrate 1 is in agreement with the alignment adjustment laser for the light axis. Since the substrate 1 is absorbed on the transparent soda glass plate 8, no hindrance is caused to alignment. Thus, cutting off is made from the rear side of the substrate with laser light source, since the surface is not contaminated with Si layer no photo resist coaing is required and the man-hours can be reduced.</p> |
