| 摘要 |
<p>A substrate for fitting circuit platelets, having insertion holes (4) which are constructed in the substrate (1) for the insertion of the platelets (2), having a thin plate (6) which is provided on the upper outer surface of the substrate (1) such that the holes (4) are covered, and which is constructed in an adhering manner on the inner surface, which covers the holes (4), and having a wiring pattern (7) which is provided on the rear surface of the substrate (1) such that it can be allocated to the electrode parts of the platelets (2) which are inserted into the insertion holes (4), so that, after insertion of the circuit platelets (2) into the insertion holes (4), the latter are temporarily firmly bonded and fixed by the plate (6), and the electrode part of each circuit platelet (2) and the associated wiring pattern (7) can be soldered and connected to one another. <IMAGE></p> |
