| 摘要 |
Improved baths for the electrodeposition of ruthenium metal on various substrates. The ruthenium metal baths are formulated with a complex of ruthenium metal and sulphamic acid wherein the molar ratio is one mole of ruthenium metal and from about 4 to 10 moles of sulphamic acid. For most purposes, certain selective metals are also present in the baths, which are maintained at a pH ranging from about 1.0 to 2.2. The process for utilizing said baths to plate substrates with essentially pure ruthenium metal is also described and claimed. |
